Disclosed is a flame-retardant polyamide composition which is excellent in mechanical properties such as toughness, and heat resistance, flame retardancy and flow ability during a reflow soldering process. In addition, this polyamide composition exhibits high thermal stability during molding. Specifically disclosed is a flame-retardant polyamide composition containing (A) 20-80% by weight of a specific polyamide resin, (B) 10-20% by weight of a metal phosphinate, (C) 0.05-1% by weight of a lithium salt, a calcium salt, a barium salt, a zinc salt or an aluminum salt of montanic acid, behenic acid or stearic acid. It is preferable that this flame-retardant polyamide composition contains no halogen flame retardant.