A semiconductor package is disclosed having a single CE signal during
electrical test and a plurality of CE signals during normal operation
thereafter. After electrical testing of the memory die during
fabrication, the electrical traces carrying the single CE signal from the
memory test pad matrix to each of the memory die may be severed. Severing
the electrical traces from the memory test pad matrix electrically
isolates the multiple electrical traces between the controller die and
memory die, and allows separate and individual CE signals between the
controller die and memory die during normal usage of the memory die.