An interconnection apparatus and a method of forming an interconnection
apparatus. Contact structures are attached to or formed on a first
substrate. The first substrate is attached to a second substrate, which
is larger than the first substrate. Multiple such first substrates may be
attached to the second substrate in order to create an array of contact
structures. Each contact structure may be elongate and resilient and may
comprise a core that is over coated with a material that imparts desired
structural properties to the contact structure.