Gold solder compositions for assembling, repairing and sizing jewelry containing about 85% to 95% by weight palladium and an alloy mixture containing about 5% to 15% gallium and indium, in a weight ratio of approximately 7:3. The invention also provides a solder composition for assembling, repairing and sizing jewelry containing white gold and palladium, but not containing nickel. Such a solder contains gold, silver, copper, zinc, palladium, gallium and indium, whereby the gallium and indium is in a weight ratio of 6:4, 7:3 or 8:2, respectively.