An epoxy adhesive composition of an epoxy resin, an epoxy terminated
liquid rubber, filler, and an amine curing package for said epoxy resin
is disclosed. Advantageously, a short chain diol will be incorporated
into the adhesive in order to enhance reactivity and strength build.
Advantageously, a mixture of amines will be used in the curative
including multifunctional aliphatic amines that improve adhesion and
strength build; tertiary amines which are used to enhance adhesion and
strength build, polyamides which can be used to provide flexibility; and
amine-terminated rubbers (ATBN) which can improve toughness and impact
resistance to the cured system. The preferred short chain diol is
glycerin. Surfaces of adherends are joined with the dried residue of the
epoxy adhesive composition by applying the epoxy resin composition to one
or both surfaces, joining the surfaces, and applying pressure, optionally
with heating.