A photoelectric conversion layer-stacked solid-state imaging element comprises: a semiconductor substrate having a signal reading circuit formed thereon; at least one layer of photoelectric conversion layer each of which is provided interposed between a common electrode layer and a plurality of pixel electrode layers corresponding to pixels, said at least one layer of photoelectric conversion layer being stacked above the semiconductor substrate via a light shielding layer; and inhibiting structures each of which inhibits a reflected light produced by reflection of incident light on the light shielding layer, the incident light having passed through said at least one layer of photoelectric conversion layer and entered into a pixel, from entering in direction toward adjacent pixels.