A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and an enlarged plated contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, the metal pillar is welded to the routing line and includes a ball bond and a stem, and the plated contact terminal is plated on the stem.

 
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