A one-part curable epoxy adhesive composition is provided. The adhesive comprises curable epoxy resin, a latent curative system comprising (a) at least one first curative encapsulated in thermoplastic polymeric microcapsules and (b) a second latent curative admixed in the curable epoxy resin, and sufficient particulate thermoplastic polymeric material to at least partially regionally plasticize the cured epoxy resin wherein up to all of the particulate thermoplastic polymeric material may be provided by the walls of the microcapsules. A method of curing the adhesive by heating the composition is also provided. A joint made by adhering members together with the adhesive composition and a method of making the joint are also provided.