A cooling device for cooling one or more electrical and/or electronic
components, also referred to as E-components. The cooling device includes
at least one cooling body which is assigned to the E-component and which
is connected to the same in a thermoconductive manner. According to this
invention, it is possible to achieve an effective heat exchange and thus a
high operating efficiency in such a system. Thus, according to this
invention the cooling body is in thermoconductive contact with a granular,
liquid or pasty filling material that is capable of conducting heat. The
liquid or pasty material is retained at least in areas by a flexible
membrane, and the membrane is connected to a surface of the E-component.
