Semiconductor device

   
   

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Porque a microplaqueta do semicondutor é large-sized, integrada altamente e apressada acima, torna-se difícil embalar a microplaqueta do semicondutor junto com ligações em um pacote. Na vista desta dificuldade, lá foi adotado a estrutura do pacote chamada a "Conduz-Em-Microplaqueta" ou "Microplaqueta-Em-Conduza" à estrutura em que o semicondutor e as ligações são empilhados e embalados. No pacote desta estrutura, de acordo com a invenção atual, a abertura entre as parcelas de extremidade principais das ligações internas e a microplaqueta do semicondutor são feitas mais largas do que aquela entre as parcelas internas da ligação exceto as parcelas de extremidade principais e a microplaqueta do semicondutor desse modo para reduzir a capacidade dispersa, melhorar a taxa da transmissão do sinal e reduzir os ruídos elétricos.

 
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