Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
   
   

Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.

 
Web www.patentalert.com

< Method of making sized paper, a sized paper grade, and a paper size

< Composition based on cross-linked starch and depolymerized starch suitable as gelatine replacement

> Cheese ripening process

> Method and system for supplying amino acids or chemical derivatives in liquid form to ruminant livestock
~ 00116