A pre-formed integrated circuit chip is encapsulated into an electronic
package, by forming an interconnect assembly separately from the
pre-formed integrated circuit chip. If the interconnect assembly tests
good it is bonded to the prepared integrated circuit chip. The
interconnect assembly is flip bonded to the chip. The interconnect
assembly and chip are passivated or potted into an integral structure to
provide the electronic package. At least one test pad is defined in an
interconnect layer, which test pad can be accessed and electrically
connected on opposing sides of the test pad. The chip is underfilled with
an insulating material to remove all voids between the chip and the
interconnect assembly. The integrated circuit chip is then thinned. The
test pad is accessed to test the chip. A plurality of interconnect
assemblies and chips are bonded together to form a corresponding plurality
of electronic packages.
