A sputtering coil for a plasma chamber in a semiconductor fabrication
system is provided. The sputtering coil couples energy into a plasma and
also provides a source of sputtering material to be sputtered onto a
workpiece from the coil to supplement material being sputtered from a
target onto the workpiece. Alternatively a plurality of coils may be
provided, one primarily for coupling energy into the plasma and the other
primarily for providing a supplemental source of sputtering material to be
sputtered on the workpiece.
