A three-dimensional stacked semiconductor package includes first and second
semiconductor chip assemblies and a conductive bond. The first
semiconductor chip assembly includes a first semiconductor chip and a
first conductive trace with a first routing line and a first pillar. The
second semiconductor chip assembly includes a second semiconductor chip
and a second conductive trace with a second routing line and a second
pillar. The chips are aligned with one another, the pillars are disposed
outside the peripheries of the chips and aligned with one another, and the
first pillar extends into a cavity in the second pillar. The conductive
bond is within the cavity and contacts and electrically connects the
pillars.
