A method of patterning a metal surface by electro-mechanical polishing is
disclosed. A metal surface is placed in fluid communication with an
abrasive surface of a pad. The two surfaces are moved relative to each
other, in acidic fluid which contains abrasive particles. An electrical
circuit is formed between the metal surface and abrasive pad and a current
is supplied to the circuit. The patterned surface then is processed into a
useful feature such as a bottom electrode for a DRAM capacitor.
