Electrically and thermally enhanced die-up ball grid array (BGA) packages
are described. A BGA package includes a stiffener, substrate, a silicon
die, and solder balls. The die is mounted to the top of the stiffener. The
stiffener is mounted to the top of the substrate. A plurality of solder
balls are attached to the bottom surface of the substrate. A top surface
of the stiffener may be patterned. A second stiffener may be attached to
the first stiffener. The substrate may include one, two, four, or other
number of metal layers. Conductive vias through a dielectric layer of the
substrate may couple the stiffener to solder balls. An opening may be
formed through the substrate, exposing a portion of the stiffener. The
stiffener may have a down-set portion. A heat slug may be attached to the
exposed portion of the stiffener. A locking mechanism may be used to
enhance attachment of the heat slug to the stiffener. The heat slug may be
directly attached to the die through an opening in the stiffener.
