A semiconductor device includes a semiconductor substrate having a first main
surface
having circuit elements formed thereon, a second main surface substantially opposite
to the first main surface, and a plurality of side faces provided between the first
main surface and the second main surface. The semiconductor device also includes
a plurality of external terminals formed over the first main surface and respectively
electrically connected to the circuit elements. The second main surface has a first
steplike section which extends from a first side face of the plurality of side
faces to a second side face opposite to the first side face.
