The present invention relates generally to permanent interconnections between
electronic devices, such as integrated circuit packages, chips, wafers and printed
circuit boards or substrates, or similar electronic devices. More particularly
it relates to high-density electronic devices.
The invention describes means and methods that can be used to counteract the
undesirable effects of thermal cycling, shock and vibrations and severe environment
conditions in general.
For leaded devices, the leads are oriented to face the thermal center of the
devices and the system they interact with.
For leadless devices, the mounting elements are treated or prepared to control
the migration of solder along the length of the elements, to ensure that those
elements retain their desired flexibility.
