A transfer method comprising a step of forming a plurality of transferred bodies
on a transfer origin substrate, and a step of applying energy to partial regions
corresponding to the transferred bodies to be transferred, and transferring these
transferred bodies corresponding to the partial regions onto a transfer destination
substrate. A plurality of transferred bodies such as devices or circuits that are
to be disposed on a transfer destination substrate with spaces therebetween can
be manufactured integrated together on a transfer origin substrate, and hence compared
with the case that the transferred bodies are formed on the transfer destination
substrate directly, the amount of materials used in the manufacture of the transferred
bodies can be reduced, the area efficiency can be greatly improved, and a transfer
destination substrate on which a large number of devices or circuits are disposed
in scattered locations can be manufactured efficiently and cheaply.
