A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane
composition of the addition curing type or peroxide curing type, (B) reinforcing
silica fines, (C) an adhesive agent, and (D) an organosilicon compound having a
functional group reactive with component (A) and a siloxane skeleton incompatible
with component (A) is easily moldable within a short time by injection molding,
suitable in primerless molding, and bondable with various thermoplastic resins.
Integrally molded articles in which the silicone rubber adhesive composition is
firmly bonded to the thermoplastic resin are obtainable without a need for modification
of the resin.
