An adhesive polyimide resin which comprises a siloxane polyimide resin obtained
from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising
(B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group
as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition
temperature of 50 to 250C and a Young's modulus (storage modulus) at 250C
of 105 Pa or higher; and a laminate which comprises a substrate comprising
a conductor layer and an insulating supporting layer having at least one polyimide
resin layer and, disposed on a surface of the substrate, an adhesive layer comprising
a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate
have satisfactory adhesion strength even after exposure to a high temperature of
up to 270C and further have excellent heat resistance in reflow ovens.
They are hence suitable for use in the bonding of electronic parts.
