The present invention is directed to an inter-laminar adhesive composition
containing a liquid epoxy resin, a polyfunctional epoxy resin having a
softening point higher than a lamination temperature of the adhesive and
with two or more epoxy groups within the molecule; and a latent epoxy
curing agent initiating a reaction at a temperature higher than the
lamination temperature. The adhesive composition optionally contains a
liquid resin other than the liquid epoxy resin and/or an organic solvent
and the liquid resin includes the liquid epoxy resin, the organic solvent
or both constituting from 10 to 55% by weight of the composition.
This inter-laminar adhesive composition allows for the preparation of a
multi-layer printed wiring board. The process for preparing the
multi-layer printed wiring board is provided. The resulting multi-layer
printed wiring board of the invention possesses excellent embedding
properties in the internal-layer circuit, excellent surface smoothness and
can be provided at high productivity levels in a building up process using
the present adhesive.
