One side of a ceramic multilayer board is attached to a resin film with adhesive,
the resin film is mounted on a mold for resin sealing having a cavity provided
in desired position, the position of the board is controlled by pressing against
a portion of the resin film by a portion of the mold for sealing, and thereafter
sealing is conducted by filling an epoxy resin into the cavity. The thus prepared
semiconductor device has a rear face on which electrodes for connecting to outside
are exposed, and the sealing resin is formed so as to be flush with respect to
the rear face of the board, surround the periphery of the board, and form a cross
section in a rectangular shape. With this configuration, the semiconductor device
free from a crack can be sealed with resin.
