There is disclosed a method of patterning an article (10) including
a layer (12) of copper formed onto an insulating substrate (11) using
a positive microcontact printing (MCP) process. In a preferred embodiment where
the metal is copper (Cu) and the substrate is a silicon wafer, the method includes
removing the native oxide presents on the Cu in a solution of HCl. Then, a stamp
(13) having a patterned polydimethylsiloxane (PDMS) body (14)
is linked with a 0.2 mM solution of pentaerythritol-tetrakis(3-mercaptopropionate)
(PTMP) in ethanol for 1 min, to form the inking layer (15). The
stamp is applied on the Cu layer to print a first self-assembled monolayer (SAM)
(16) according to a desired pattern. The article is dipped in a
solution of ECT which is then adsorbed only in the non printed regions, forming
a second SAM (18) in a configuration that is complementary to the desired
pattern. Finally, the printed areas of the Cu layer are removed using a peroxodisulfate
etch bath.
