A bump structure of a scattering reflective board and a method for manufacturing
the bump structure. Multiple strip-shaped shielding sections are arranged on an
optical mask at intervals. Multiple irregularly arranged circular holes are distributed
in the respective strip-shaped shielding sections. Multiple irregularly arranged
circular shielding sections are distributed in spacing sections between the adjacent
strip-shaped shielding sections. Multiple irregularly arranged arch notches and
arch shielding sections are distributed on the edges of the strip-shaped shielding
sections. After exposed and developed, multiple scattered and irregularly arranged
bumps are formed on the photosensitive material layer laid on the substrate. Then
a reflective film is laid on the substrate and the bumps to form the reflective board.
