A method for controlling a processing tool having a plurality of chambers includes
processing a wafer in a first chamber of the processing tool; measuring a characteristic
of the wafer; and modifying an operating recipe of one of the plurality of chambers
based on the measured characteristic. A system for processing semiconductor wafers
includes a processing tool, a metrology tool, and a process controller. The processing
tool includes a plurality of chambers. The metrology tool is adapted to measure
a characteristic of a wafer processed in a first chamber of the processing tool.
The process controller is adapted to modify an operating recipe of one of the plurality
of chambers based on the measured characteristic.
