Semiconductor power device having a diamond shaped metal interconnect scheme

   
   

A transistor (10) is formed as a matrix of transistor cells (13) that have drain metal strips (50) for contacting drains (15) of the transistor cells and source metal strips (55) for contacting sources (35) of the transistor cells. An interconnect layer (1030) overlying the matrix of transistor cells has first portions (201) that contact one the drain metal strips with first and second vias (79) and second portions (101) that contact one of the source metal strips with third and fourth vias (78).

 
Web www.patentalert.com

< Silicon-based thin film forming apparatus, silicon-based thin film forming method and semiconductor element

< Ultraviolet-transparent conductive film and process for producing the same

> Plasma display panel having trench discharge cells with one or more electrodes formed therein and extended to outside of the trench

> Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

~ 00183