An interconnect is described including a semiconductor substrate having opposing
surfaces, including first and second insulated conductors for transmitting signals.
A third conductor substantially surrounds and is electrically insulated from the
first and second insulated conductors. Capacitance between the first insulated
conductor and the third conductor is substantially equivalent to capacitance between
the second insulated conductor and the third conductor. The first insulated conductor
and the second insulated conductor are disposed between the opposing surfaces of
the semiconductor substrate.
