There is here disclosed a semiconductor device comprising a chip-mounting-member
having a lead formed on its major surface, the lead having a thin film plated portion
which covers a surface of a predetermined portion of the lead, a semiconductor
chip having a bump formed on its major surface, and mounted on the chip-mounting-member
by electrically connecting the bump to the lead via the plated portion, and an
encapsulating-member formed between the semiconductor chip and the chip-mounting-member.
