A light-emitting semiconductor component has a semiconductor element containing
an active layer, electrical contacts for impressing a current into the active layer
(heat being generated at the active layer and at the electrical contacts during
operation), and a carrier with a large thermal capacity for absorbing the heat
generated during operation. The rear side of the semiconductor element is (electrically
and/or thermally) connected to the carrier by a adhesive. Recesses, which accommodate
a part of the adhesive when the semiconductor element is connected to the carrier,
are provided in the rear side of the semiconductor element.
