An image sensor having an improved transparent layer includes a substrate, a
frame
layer, a photosensitive chip, a plurality of wires, and a transparent layer. The
substrate has an upper surface formed with a plurality of first connected points.
The frame layer is arranged on the upper surface of the substrate so as to form
a cavity together with the substrate. The photosensitive chip is mounted on the
upper surface of the substrate and within the cavity. The plurality of wires are
electrically connected the photosensitive chip to the first connected point of
the substrate. The transparent layer is covered on the frame layer for covering
the photosensitive chip so that the photosensitive chip may receive optical signals
passing through the transparent layer, respectively, at the peripheries of the
transparent layer are formed with cutcorners. Therefore, the transparent
layer may be decreased collision and may be increased the cleanness of the transparent
layer, therefore, simplifying the manufacturing processes and decreasing the manufacturing cost.
