Structures and methods for providing magnetic shielding for integrated
circuits are disclosed. The shielding comprises a foil or sheet of magnetically
permeable material applied to an outer surface of a molded (e.g., epoxy) integrated
circuit package. The foil can be held in place by adhesive or by mechanical means.
The thickness of the shielding can be tailored to a customer's specific needs,
and can be applied after all high temperature processing, such that a degaussed
shield can be provided despite use of strong magnetic fields during high temperature
processing, which fields are employed to maintain pinned magnetic layers within
the integrated circuit.
