A semiconductor device, which is obtained by sticking an adhesive sheet 1
comprising
a base material 2, an adhesive agent layer 3 formed on the base material
2 and conductor bodies 4 buried in the adhesive agent layer 3
to a semiconductor wafer, and removing the base material from the adhesive
agent layer of the adhesive sheet 1. The adhesive agent layer 3 and
a substrate are then aligned and the semiconductor wafer and the substrates are
adhered via the adhesive agent layer 3 to thereby avoid defects caused by
fluidity of an under filling material.
