A surface-mountable glass-sealed light-emitting diode is provided. It has high
reliability and high external quantum efficiency, and can achieve a low-cost components-implemented
board. An LED bare chip (1) has opposite surfaces, which are provided with
electrodes (2) for supplying power from external. A pair of dumet wires
(3) are separately connected to the respective electrodes (2) sandwiching
the LED bare chip (1) therebetween. The LED bare chip (1), the electrodes
(2) and parts of the dumet wires (3) are integrally glass-sealed
(4). A pair of metallic disc plates (6) have holes (5) formed
through the center. They are secured on both sides of the glass seal (4)
and solder-plated, allowing the pair of dumet wires (3) projected from the
glass seal to pass through the holes (5).
