A semiconductor device has a semiconductor chip, a first insulating film and
an
inductor. The semiconductor chip includes an integrated circuit formed on the main
surface of the chip and a plurality of pad electrodes formed on the main surface
of the chip and electrically connected to the integrated circuit. The first insulating
film of an insulating resin material is formed on the main surface of the semiconductor
chip, covers the integrated circuit, and includes a plurality of contact holes
provided on the respective pad electrodes. The inductor is formed on the inductor
formation region of the first insulating film, and both terminals of the inductor
are connected to the pad electrodes through the contact holes, respectively. The
inductor formation region of the first insulating film is formed thicker than a
portion of the first insulating film around the contact hole.
