A semiconductor device including a semiconductor device package providing a capacitor
in its circuit board and a semiconductor chip mounted on that package, wherein
the capacitor is provided directly under a semiconductor chip mounting surface
of the circuit board on which the semiconductor chip is to be mounted and the conductor
circuit electrically connecting the semiconductor chip and capacitor is made the
shortest distance by having the external connection terminals of the capacitor
directly connected to the other surface of the connection pads exposed at one surface
at the semiconductor chip mounting surface of the circuit board and to which the
electrode terminals of the semiconductor chip are to be directly connected.
