A cathode potential is applied to a conductive layer formed on a substrate having
a depression pattern. A plating solution in electrical contact with an anode is
supplied to the conductive layer to form a plating film on the conductive layer.
At this time, the plating solution is supplied by causing an impregnated member
containing the plating solution to face the conductive layer. Since the plating
solution stays in the depression, a larger amount of plating solution is supplied
than on the upper surface of the substrate, and the plating rate of the plating
film in the depression increases. Consequently, the plating film can be preferentially
formed in the depression such as a groove or hole.
