A semiconductor device includes a substrate which has a main surface, a back
surface,
and a through hole. The semiconductor device also includes an insulating film formed
on an inner wall of the through hole, a conductive member provided on the insulating
film within the through hole, an external terminal provided above the main surface,
and a wiring portion connected to the external terminal. The semiconductor device
also includes an encapsulating layer which covers the main surface and the wiring
portion except for a portion to which the external terminal is connected. A side
surface of the encapsulating layer is formed inside a side surface of the substrate.
