A method and associated apparatus includes depositing metal on a plating surface
of an object immersed in an electrolyte solution prior to bulk deposition on the
plating surface. In one aspect, the method further includes applying a voltage
between an anode and the plating surface to enhance the concentration of metal
ions in the electrolyte solution that is contained in a feature on the plating
surface prior to the bulk deposition on the plating surface.
