An apparatus of the invention has a closable chamber that can be sealed and is
capable of withstanding an increased pressure and high temperature. The chamber
contains a substrate holder that can be rotated around a vertical axis, and an
edge-grip mechanism inside the substrate holder. The deposition chamber has several
inlet ports for the supply of various process liquids, such as deposition solutions,
DI water for rinsing, etc., and a port for the supply of a gas under pressure.
The apparatus is also provided with reservoirs and tanks for processing liquids
and gases, as well as with a solution heater and a control system for controlling
temperature and pressure in the chamber. The heater can be located outside the
working chamber or built into the substrate holder, or both heaters can be used
simultaneously. Uniform deposition is achieved by carrying out the deposition process
under pressure and under temperature slightly below the boiling point of the solution.
The solution can be supplied from above via a shower head formed in the cover,
or through the bottom of the chamber. Rinsing or other auxiliary solutions are
supplied via a radially moveable chemical dispensing arm that can be arranged above
the substrate parallel thereto.
