The present invention discloses reworkable epoxy compositions suitable for encapsulation
of and underfill for electronic components including (a) the epoxidized reaction
product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl
carboxylic acid, the epoxidized reaction product having two or more thermally labile
alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The
epoxy composition, when cured, provides a composition which is thermally reworkable,
the weak -alkoxy ester linkages providing for the reworkable aspect of the invention.
