A single layer ceramic capacitor for wire bonding or solder or epoxy attachment
wherein a bottom metallization is of a lesser purity than a top metallization whereby
the bottom metallization may be effectively soldered without leaching of the metal
and the top metallization may be wire bonded. In an exemplary embodiment, the top
metallization is essentially pure gold and the bottom metallization is an alloy
of gold and platinum and/or palladium. The top and bottom metallizations are provided
on a dielectric body that advantageously comprises a ceramic having a sintering
temperature below the melting point of gold. In a further exemplary embodiment,
the capacitance of the capacitor may be enhanced by providing one or more interior
metallization planes parallel to the exterior metallizations and connected thereto
by conductive vias.
