Several embodiments of enhanced integrated circuit probe card and package
assemblies are disclosed, which extend the mechanical compliance of both MEMS and
thin-film fabricated probes, such that these types of spring probe structures can
be used to test one or more integrated circuits on a semiconductor wafer. Several
embodiments of probe card assemblies, which provide tight signal pad pitch compliance
and/or enable high levels of parallel testing in commercial wafer probing equipment,
are disclosed. In some preferred embodiments, the probe card assembly structures
include separable standard components, which reduce assembly manufacturing cost
and manufacturing time. These structures and assemblies enable high speed testing
in wafer form. The probes also have built in mechanical protection for both the
integrated circuits and the MEMS or thin film fabricated spring tips and probe
layout structures on substrates. Alternate card assembly structures comprise a
compliant carrier structure, such as a decal or screen, which is adhesively attached
to the probe chip substrate.
