Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
   
   

A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

 
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< Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape

< Crack propagation stops for dicing of planar lightwave circuit devices

> Method of fabricating semiconductor devices on a semiconductor wafer using a carrier plate during grinding and dicing steps

> Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits
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