One aspect of the present invention relates to a method of dicing a substrate
containing a plurality of non-rectangular shaped optical integrated circuits, involving
forming stop cracks in the wafer, each stop crack adjacent and substantially parallel
one of the non-rectangular shaped optical integrated circuits, and cutting the
substrate in a curvilinear manner substantially parallel to a stop crack. Another
aspect of the present invention relates to an optical structure containing a substrate;
a plurality of non-rectangular shaped optical integrated circuits on the substrate,
each non-rectangular shaped optical integrated circuit having an active region;
and at least one stop crack positioned adjacent each non-rectangular shaped optical
integrated circuit.
