A side-emission type semiconductor light-emitting device 10 includes a
substrate
12, and the substrate 12 is provided with a case 14 formed
of a resin having opacity and reflectivity. The substrate 12 is formed,
on its surface, with electrodes 18a and 18b onto which
an LED chip 20 is bonded. A transparent or translucent resin 16 is
charged between the substrate 12 and the case 14 whereby the LED
chip 20 is molded. A light-emitting surface of the side-emission type semiconductor
light-emitting device 10 includes surfaces 16a, 16b
and a surface opposite to the surface 16b which are formed of
the transparent or translucent resin 16. Furthermore, the light-emitting
surface is formed by a roughened surface. Due to this, a light outputted from the
LED chip and a light reflected from the case 14 is scattered by the light-emitting surface.
