In a semiconductor laser device, a plane of polarization of a laser beam emitted
by a semiconductor laser (4) is inclined from a substrate surface (4A),
allowing the semiconductor laser (4) to be higher in power and higher in
reliability. Moreover, a die-bond surface (17) of this semiconductor laser
(4) is inclined by a specified inclination angle with respect to
the reference surface (3) of the stem body (1), so that the plane
of polarization of the laser beam can be made generally parallel to the reference
surface (3) of the stem body (1). Thus, there can be provided a semiconductor
laser device which is capable of contributing to a thinning of an optical pickup
device and easy to manufacture.
