A ceramic joint body including a ceramic substrate and a ceramic body such as
a
cylindrical body firmly bonded to each other and excellent in corrosion resistance
in the ceramic substrate for use for a semiconductor product producing/examining
the step. The ceramic bonded body includes a ceramic substrate in which a conductor
is provided, and a ceramic body bonded to a bottom face of the ceramic substrate.
The ceramic bonded body has a region, where no conductor is formed, in at least
a part of a region above a bonding interface between the ceramic substrate and
the ceramic body.
