A packaging structure suitable for an integrated circuit device receiving short-wavelength
laser light is provided. The integrated circuit device having a photo detecting
part, leads and wires for connection therebetween are encapsulated in an encapsulation
section. A recess is formed on the light incident surface of the encapsulation
section above the photo detecting part, to thin the encapsulation section on the
surface of the photo detecting part and thereby reduce the energy of light absorbed
by the encapsulation section.
