A photo-sensing device package is provided. The package includes a substrate,
least one photo-sensing semiconductor die coupled to the substrate, and a patterned
layer formed on a light receiving surface of the substrate. The substrate is formed
of a material substantially transparent to light within a predetermined range of
wavelengths, provided with front and backside surfaces on opposite sides thereof.
The photo-sensing semiconductor die defines at least one photo-sensing area opposing
the substrate front surface for receiving light impinging upon the substrate's
backside surface and passing therethrough. The patterned layer is formed on the
substrate's backside surface for blocking passage of at least a portion of the
light otherwise impinging upon that backside surface, and is formed with a window
opening aligned with at least a portion of the photo-sensing area for optical communication
therewith through the substrate.